Product

    • Heatsink
      • CPU Heatsink
        • Universal Platform
        • Socket LGA 2011
        • Socket LGA 1366
        • Socket LGA 1155
        • Socket LGA 1156
        • Socket AM3
        • Socket AM2
        • Socket LGA 775
        • Socket LGA 771
      • VGA Heatsink
        • GPU Heatsink
        • VRM Heatsink
      • Chipset Heatsink
      • Game Console
      • Water Cooling
      • Heatsink Cleaner
      • RAM Heatsink
      • Mosfet Sink
    • System Fan
      • 150 mm
      • 140 mm
      • 120 mm
      • Fan Cover
    • Accessories
      • Retention Module
      • Thermal Paste
      • Bolt-thru Mounting kit
      • Fan Clips
      • Metal Back Plate
      • Ram sink
    • Archives
      • BTK
      • CPU Heatsink
      • VGA Heatsink
    Home Product Accessories Thermal Paste
    • Thermal Paste
    • Chill Factor3

    Chill Factor3 Back

    Less silicon oil and less vaporation, no drying out, give you stable performance over time.

    An even better thermal conductivity, bring you an new era of TIM.

    Not Flammable.

    Best price-to-performance ratio.

    CFIII does not contain any metal or other electrically conductive materials.