Motherboard Compatibility
Intel: Socket LGA 1150/1151/1155/1156/1366/2011/2011-3
AMD: Socket AM2/AM2 /AM3/AM3 /FM1/FM2

Motherboard Form Factor Compatibility
ATX, Enhanced ATX, Micro-ATX
Most ATX and mATX motherboards are compatible
(User report not compatible boards here.)
Not compatible


Product Description

Technical Spec :

Heatsink Specifications:
Dimension: L150mm x W120mm x H159mm
Weight: 1120g
Heat pipes: 6mm heatpipe*8 units
Fin: T = 0.5 mm ; Gap = 2.8 mm
Fin Pcs: 35 pcs
Copper Base: C1100 Pure copper nickel plated
Motherboard to Fin: 36 8 = 44 mm 46 8=54 mm

Putting a Silence to Heat


The HR-22 is Thermalright’s super flagship cooler and accumulation of over 10 years of thermal
innovation and technology. Design based on our new Directed Passive Airflow System, the HR-22 from
the ground up was designed for 0 CPU Fan passive cooling.What is DPAS?
DPAS is a comprehensive system of optimizations that takes total advantage of the natural airflow
current within an enclosed PC-case. It is the accumulation of heatsink technology that works together to
orchestrate PC-case airflow for maximum passive CPU heat dissipation.Our Directed Passive Airflow System contains specific design guidelines for:
Heatsink Fin Gap
Heatsink Fin Shape and Patented Fin Through Holes
Heatsink Structural Shape and X/Y Axis Displacement
Thermalright Proprietary Airflow Tunnel Add-on KitWith our Directed Passive Airflow system, the HR-22 can cool down the latest high-end AMD and Intel
systems purely on case airflow generated by the system fans. And in fact letting PC users (sorry Mac!)
eliminate the need for one of the noisiest component in your PC chassis (CPU FAN)! You think other
sound/noise/silent optimized coolers have a chance? Try beating 0dBA!
Axis Displacement
Heatsink Body Axis Displacement, no Interference with PCIE Slot 1 and RAM Slots on ATX or Micro ATX Boards.


Aerodynamic Fin Design
HR Series Patent Through Holes, with Advanced Radial Alignment, for enhanced directed airflow and extra Heat Dissipation Surface Area.


Airflow Tunnel
Proprietary Airflow Tunnel add-on kit for a 5-10% performance increase in Passive Cooling mode.


Area of Effect XL
40% Larger Heat Dissipation Surface Area than it’s predecessor, and largest Heat Dissipation Surface Area to date among Thermalright Heatsinks.


8X Premium Copper Heatpipes
Eight 6mm Fully Sintered Copper Heatpipes, ideal for high TDP cooling usage.
Technic 3D Nikktech ExtremeSystems Computerbase Hardwareluxx Hardwaremax SilentPCReview
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