Venomous X

All new patented multiple support pressure vault bracket system, allow users adding pressure to the bracket system (40~70 lbs.), and have a more efficient and secure mounting.(1366 / 1156 / 775) .

Mirrored copper base increasingly upgrade the quality and the performance of the heatsink .

Special bent winglet design, allows hot air to pass the heatsink more rapidly .

Heatsink are all nickel plated to ensure the best quality and performance and could last for years .

Soldered heatpipes, copper base and fins, to ensure the best thermal conducting efficiency .

Six sintered heatpipe design, all heatpipes are nickel plated.To slow the oxidation deterioration to the heatpipe, to ensure longer usage and performance of the heatsink for the cpu .

Including 2 sets of 120 x 25mm fan clips and Chill factor II thermal paste .

Convex copper base design, to ensure the Highest thermal conducting thermal efficiency between the cpu and the heatsink .

Compatible with Socket 1366/1156/775 & AM2/AM3


Product Description

Heatsink Specifications:
Size: Length 127mm x Width 63mm x Height 160mm
Weight: 755 g (excluding fan and bracket system)
Heatpipe: 6mm sintered heatpipe x 6 units
Copper base: C1100 pure nickel plated copper base, with ultra-shine mirrored surface.


Compatible with the ASUS ROG X-Socket

Step two would be recognizing the motherboards, please see below picture for your reference (ASUS P7P55D, as shown in picture)

Proceeding onto step two, on whether the memory chips would be in the way of the cpu heatsink; if all slots are filled. Please first measure the distance between the centre point of the CPU HIS to the centre of the first memory slot, if it was shorter than 60mm, then you will be needing memory chips that is shorter than 43mm in height, anything more than that, you would be unsuccessful with the installation. (as shown in picture , the distance is 53mm, so first slot will not be able to use memory chip that is taller than 43mm.)

If you have measured that the distance between the centre of the CPU HIS to the centre of the first memory slot is more than 60mm. there will be no problem with your memory, even the tall HyperX could be filled in all the memory slots and still have no problem with the installation of the cpu heatsink).

Distance from centre of CPU HIS to the first memory slot, not more than 60mm, only memory chip below 43mm in height can be used .
If centre of the HIS to the first memory slot is more than 60mm in length, you are safe .
The intervention between the cpu heatsink and the memory chips often occurs with motherboards with 1156 socket .

Below are all the memory specs that we could supply, if you want to know any other brands or willing to share your information with us, please mail it to HERE .

Brand – Product name:
Corsair Dominator GT DDR3 Memory Kits
Corsair Dominator DDR3 Memory Kits
Corsair XMS3 Xtreme Performance DDR3 Memory
Kingston HyperX T1 DDR3
Kingston HyperX DDR3
G-Skill [ Ripjaws ]
G Skill [ ECO ]
G Skill [ P I ]
G Skill [ HZ ]
G Skill [ Trident ]
G Skill [ PIS ] w/o fan
Mushkin Redline
Mushkin Blackline
Mushkin Silverline
Memory chip without stock ramsink

We understand the trend of memory chips has been getting taller and taller in height due to their design of stock ram sinks, many users came to us and asked about the compatibility of our cpu heatsink, if these tall memory chips are to be installed in all slots. (1156= 4 slots / 1366= 6 slots ) .
Today we are going to explain on the height issue of these tall memories chips and on how to recognize them, before proceeding installation of our cpu heatsink .
We have found that these issues often occur with motherboards with 1156 socket ,
Please see below for our explanation:

Our first step would be measuring the height of your memory chip, please see below picture for your reference .
( HyperX T1, as shown in picture)

From all different brands of memory chips, the memory chip would have intervened the installation of the cpu heatsink, only if it’s taller than 43mm in height, but if you do, don’t panic, please see below for step II for our further explanation.

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